TSRC Corporation is pleased to announce its participation in the Munich Adhesives and Finishing Symposium (MKVS) scheduled to take place from October 23rd to 25th, 2023, in Munich, Germany.<\/p>\n
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TSRC has the privilege of delivering a presentation titled “Novel Styrene-Isoprene Block Co-Polymer for Hot Melt Label Adhesives.” which will be given by Geert Vermunicht, Ph.D.. During the event, TSRC will highlight its innovative advancements in SIS (Styrene-Isoprene-Styrene) for adhesives, specifically designed to meet the rigorous requirements of PSA (pressure-sensitive adhesives). These advancements include exceptional moisture resistance, low-temperature properties, and reduced elasticity, resulting in improved die-cutting convenience and enhanced adhesive performance. Mark your calendars for our presentation on October 25th at 10:30 am.<\/strong><\/p>\n <\/p>\n At TSRC, we are committed to delivering high-quality solutions that cater to the evolving needs of our customers and the industry. Don’t miss this opportunity to explore TSRC Corporation’s state-of-the-art solutions and engage with our team of experts. We look forward to welcoming you at MKVS.<\/p>\n"}]},"yoast_head":"\n\n\n\n\n\n\n\n\n\n